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植球 Wafer bump Bonder

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更新時(shí)間：2024-06-11 09:15:42瀏覽次數(shù)：133次

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植球 Wafer bump Bonder

詳細(xì)介紹

Wafer Bump Bonder特點(diǎn)：

High-speed bonding of 30 ms/bump based on Wire Bonder model UTC-5000

Capable of handling up to 6-inch wafers by incorporating wafer rotary stage

※8-inch wafer handling capability (1 wafer stage) scheduled to be developed

Equipped with Two wafer stages with temperature up/down control function,

reducing wafer changeover time and increasing productivity

Capable of stable 45 μm pad pitch bonding with low vibration,

high-speed drive using Shinkawa NRS technology

Automatic correction of capillary tip position by Shinkawa RPS technology,

enabling high accuracy bond placement and reducing work for capillary change

Automatic free air ball monitor function (FAM) measuring free air ball size

Multiple choices for surface contact detection at bonding, with "Force detection mode" to detect change

in force in real time as well as conventional "Positional detection mode," enabling stable bonding quality

Wafer Bump Bonder規(guī)格參數(shù)：

Product Name	Bump Bonder
Model	SBB-5200
Bonding Accuracy	±2.5 μm（3σ）Using Shinkawa standard device
Correction of Bonding Position	System to check and correct capillary offset prior to bonding through Shinkawa RPS
Bonding Speed	30 ms/ bump (without reverse) Using Shinkawa standard device
Bonding Wire Length	8 mm maximum (Varies depending on device conditions)
Resolution	XY-table: 0.1 μm Z-axis: 0.1 μm
Vibration Control	Shinkawa NRS - Non Reaction Servo System
Bonding Area	Maximum φ150 mm (6-inch wafer)
Wire Size	Au　φ15–32 μm
Bonding Force	Maximum 4.9 N
No. of Bonding Bumps	30,000 bumps maximum
Wafer Stage	2 wafer stages for 6-inch wafers　 ※with temperature up/down control function
Wafer Size	Size：Maximum 6 inches (Conversion parts are required when wafer size changes.)
Wafer Size	Thickness：0.15–0.6 mm (Conversion parts may be required when wafer thickness changes.)
Production Management	Management of equipment availability through production management monitoring screen
Options Available	Automatic wafer loader for 6-inch wafer (Under development)
Utilities	Input Power Supply：Single Phase 100 VAC (±5% input variation)　 50/60Hz (other voltage requires transformer)
	Power Consumption：Approx. 1.1kVA
	CDA：500kPa (5 kgf/cm2) 100L/min
	Vacuum：-74kPa or below (-550 mmHg) (gauge)
Physical Dimensions and Mass	1,000W × 1,088D × 2,087H mm Approx.500 kg